Toshiba Adds Dual-Sided Cooling to Power MOSFETs for Motor Control, Power Supplies

IRVINE, Calif., June 22, 2017Toshiba America Electronic Components, Inc. (TAEC)* has extended its range of high-efficiency U-MOS IX-H MOSFETs. The new 60V TPW1R306PL is an N-channel device in a DSOP Advance surface mount device (SMD) package that offers dual-sided cooling. The enhanced thermal dissipation provided by dual-sided cooling can help to reduce device count and save space in applications with high component density, including: DC-DC converters, secondary-side circuits of AC-DC power supplies and motor drives in cordless home appliances and power tools.

The TPW1R306PL has an ultra-low typical on-resistance (@VGS =10V) of just 0.95mΩ and is offered in a very small form factor of 5x6mm. Maximum drain current and power dissipation are 100A and 170W, respectively. Additionally, the TPW1R306PL’s top-of-package thermal resistance rating (Rth (ch-c) of 0.88k/W) is very low.

Toshiba’s U-MOS IX-H process enables an exceptional performance trade-off between RDS(ON) and output capacitance/output charge, making typical QOSS just 77.5nC (@VDS=30V, f=1MHz). This allows designers to further improve system performance and efficiency by raising switching speeds and reducing switching losses.

Specifications

VDSS
(V)

PKG

Part No.

RDS(ON) (mΩ)

Ciss
(Typ.)
(pF)

Crss
(Typ.)
(pF)

Coss
(Typ.)
(pF)

Qg
(Typ.)
(nC)

rg
(Typ)
(Ω)

ES
(CY)

MP
First
output
(CY)

Gen.

Order Input
start
(CY)

MP
First
output
(CY)

VGS10V

VGS4.5V

Typ.

MAX

Typ.

MAX

60

DSOP Advance
(5×6)
Both-side Cooling

TPW1R306PL

0.95

1.29

1.5

2.3

6250

80

1160

91

0.5

OK

OK

IX

OK

OK

Pricing and Availability
The TPW1R306PL is available now. For more details, samples and pricing information, please contact your local Toshiba Sales Office.

*About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide.  A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, and advanced materials that make possible today’s leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan’s largest semiconductor, solid state drive and hard disk drive manufacturer and the world’s seventh largest semiconductor manufacturer (Gartner, 2015 Worldwide Semiconductor Revenue, January, 2016). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 550 consolidated companies employing over 188,000 people worldwide (as of March 31, 2016). Visit Toshiba’s web site at http://toshiba.semicon-storage.com.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.

MEDIA CONTACT:
Dena Jacobson
Lages & Associates
Tel.: (949) 453-8080
dena@lages.com

 

SOURCE Toshiba America Electronic Components, Inc. (TAEC)

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