November 29, 2016 (Newswire.com) –
Greg Waite, CEO of InventionShare™, announced today that Circuit Seed™, the world’s best ‘analog in digital’ circuits that help manufacturers make almost every electronic device with analog substantially better, has released its new low noise transimpedance amplifier (CiTIA) just in time for the 62nd International Electron Devices Meeting (IEDM 2016) being held Dec 5-7th in San Francisco.
“The impact of the CiTIA cannot be overstated as it is almost ubiquitous and will ripple through IoT, IoE applications including communications,” said Waite. “There will be many opportunities for technical and business disruption across a number of vertical and horizontal applications with this new foundational circuit.”
Circuit Seed investigates, re-thinks, and successfully discovers novel approaches to circuit structures, topologies, and functionality resulting in silicon-proven optimal performance, lower-power, reduced area, scalability, and increased flexibility for deep sub-µm CMOS technologies. Mr. Waite said, “With Circuit Seed we have a team of highly-skilled, experienced IC designer-inventors in the areas of analog, digital, mixed-signal, and RF design. Circuit Seed’s strength and focus reside in the ability to create next generation, game-changing integrated circuit IP which will radically benefit those who acquire these designs for their use in their products.”
The new simulation results show the low noise differential CiTIA can be used as an isolator circuit where it has inherent concurrent signal separation/isolation properties of up to 200dB (10 Billion to 1). Mr. Waite said that of course this cannot be accurately measured, but it does demonstrate very significant separation.
Any signal can be transmitted on an antenna or wire while concurrently receiving any other signal on the same antenna or wire, without restrictions (from the noise floor to signal clipping) of signal shape, bandwidth, amplitude, or frequency, manifesting true full duplex wireless communication. In addition to communication, this has a wide application in sensors that can be integrated into any digital CMOS IC process and does not require analog extensions. The simulation results are in 180 nm IC Node. Overall performance will improve as the process node gets smaller.
The CiTIA circuit can easily be combined with Circuit Seed’s Full Differential OP Amp circuit for applications requiring higher gain all on the same IC. These circuits are small, low power, very low noise, high performance, and very fast – making them ideal for low power electronic applications. All Circuit Seed designs are in a 100% digital process and require no external transistors, capacitors or inductors and do not require current mirrors or matched pairs. Circuit Seed digital designs for processing analog signal use their fundamental building blocks including their Complimentary Current Field Effect Transistor (CiFET).
Mr. Waite said that Circuit Seed designs are ‘lego-like’ building blocks that can be combined in an unlimited number of ways to build any analog function including ADCs, DACs, amplifiers, phase lock loops, oscillators, comparators, voltage references, modulators, demodulators, mixers, filters, etc. The designs are 100% scalable to small IC nodes and work with planar transistors and finFETs unlike regular analog designs, the designs are 100% reusable, simplifying circuit design and reducing the time and overall cost of ownership.
For information on working with Circuit Seed in regards to product development, partnering or licencing and for any special projects, contact Keith Taylor Vice President of Licensing and Acquisitions at firstname.lastname@example.org or 613-225-7236 extension 135.
For more media information, contact Kensel J. Tracy email@example.com or 613-225-7236 extension 116.
The CiTIA data sheet can be downloaded here www.circuitseed.com
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About Circuit Seed™
Circuit Seed investigates, re-thinks, and successfully discovers novel approaches to circuit structures, topologies, and functionality resulting in silicon-proven optimal performance, lower-power, reduced area, scalability, and increased flexibility for deep sub-µm CMOS technologies.